Acoustic Cavitation Measurements

using Sonoluminescence and Frequency Components

by Robert Zuniga

Project Description

The removal of particles from the surface of semiconductor wafers is an important step in the fabrication of semiconductor devices. An understanding of exactly how particles are removed when megasonic cleaning techniques are used, is under investigation. Acoustic cavitation is one possible particle removal mechanism. Essentially, cavitation bubbles generate shock waves that may dislodge particles from the wafer surface. This investigation is focused on experimentally determining acoustic cavitation distributions from sonoluminescence and frequency components for the megasonic range of interest.

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